Advertisement
Advertisement
SurfaceTechnology GERMANY, 16 - 18 June 2020
Homepage>Exhibitors & Products >CHEMICAL METALLIZATION FOR EMI SHIELDING

CHEMICAL METALLIZATION FOR EMI SHIELDING

Metal layers to shield from electromagnetic interferences

Logo CHEMICAL METALLIZATION FOR EMI SHIELDING

Product description

We deposit thin layers of different metals which can absorb and reflect electromagnetic waves. The treatment is applied to the plastic for protection of internal circuit boards. Available shielding between 10 and 2000 Mhz, depending on the final use of the equipment. Wide range of plastic to metalize (PS, ABS, PC-GF-FR, PC+ABS, PPO, Nylon, PAI, PU) and details of various formats.

Chemical metallization DST (Double Side Treatment) metallization on both surfaces of the substrates, more shielding power.
Chemical metallization SST (Single Side Treatment) metallization of single side. Only on areas chosen by customer.
Conductive coatings: wide range of plastics to coat, showing excellent performance of adhesion and chemical resistance.

Product website

Hall 1, Stand K41

Stored items

0

Server communication error: Item could not be saved.