In Feldkirchen, surface and structural analyses are performed using XPS, TOF-SIMS and Auger electron spectroscopy. These methods detect the outermost atomic layers and enable elemental, chemical state and trace analyses. Typical questions concern contamination, corrosion, layer compositions or process-related changes.

High-resolution 3D computer tomography is also used. It allows non-destructive volume examinations, for example of solder joints, porosities or battery cells, and makes internal defects visible.

The process includes enquiry, coordination of the examination strategy, measurement, evaluation and reporting. Different methods can be combined to comprehensively analyse material- and application-specific issues.